From tin plate, nickel silver, stainless steel to copper alloys, each material offers unique shielding performance, welding processes, and cost advantages. This guide will help you select the optimal material solution based on your application requirements.
Core performance metrics comparison of six mainstream shielding materials. Red indicates best, green indicates good, yellow indicates fair.
| Material | Conductivity (%IACS) |
Permeability (μr) |
Density (g/cm³) |
Weldability | Corrosion Resistance | Cost (Relative) |
Common Thickness (mm) |
|---|---|---|---|---|---|---|---|
| Tin Plate (SPTE) | ~15% | High | 7.85 | Excellent | Good | 1.0x | 0.15-0.25 |
| Nickel Silver (C7521) | ~6% | 1.0 | 8.8 | Good | Excellent | 3.0x | 0.15-0.20 |
| Stainless Steel (SUS304) | ~5% | 800-1000 | 7.93 | Moderate | Excellent | 2.0x | 0.20-0.30 |
| Copper (C1100) | 100% | 1.0 | 8.96 | Excellent | Good | 5.0x | 0.10-0.20 |
| Brass (C2680) | ~27% | 1.0 | 8.5 | Excellent | Good | 2.5x | 0.15-0.25 |
| Aluminum Alloy (1100/3003) | ~35% | 1.0 | 2.7 | Moderate | Good | 0.8x | 0.20-0.30 |
Click each material to learn detailed performance specifications, application scenarios, and technical specifications.
Steel surface tin-plated, the top cost-effective choice, widely used in consumer electronics. Excellent weldability, supports SMT process.
Cu-Ni-Zn alloy, excellent elasticity and corrosion resistance, ideal for high-reliability applications requiring repeated assembly/disassembly.
High strength and durability, ideal for automotive electronics, industrial environments and other demanding applications. Heat and corrosion resistant with magnetic shielding characteristics.
Highest electrical conductivity, superior EMI shielding performance. Ideal for high-performance RF shielding, magnetic shielding and protection applications. Easily machined into complex shapes.
Aluminum alloy lightweight design, Mu-Metal (permalloy) magnetic shielding, Beryllium copper high elasticity. Ideal for wearable devices and aerospace applications.
According to your application requirements, follow the decision flow below to quickly identify the optimal material.
Material requirements vary significantly across industries. The table below shows the optimal material solutions for each industry.
| Application Industry | Recommended Material | Reason | Alternative Solution |
|---|---|---|---|
| Smartphones | Tin Plate (SPTE) | Cost-effective, easy to weld, supports SMT high-volume production | Aluminum Alloy (lightweight) |
| 5G/Millimeter Wave Modules | Copper (C1100) | Highest conductivity, optimal shielding performance | Brass (cost-balanced) |
| Automotive Electronics (ECU/ADAS) | Stainless Steel (SUS304) | Heat resistant, vibration resistant, corrosion resistant, meets automotive-grade reliability | Phosphor Bronze Spring (contacts) |
| Industrial Control / Servers | Stainless Steel (SUS304) | High strength, resistant to extreme temperatures and corrosion | Copper (high-performance servers) |
| Medical Devices | Nickel Silver (C7521) | Supports repeated disassembly, corrosion resistant, hypoallergenic | Stainless Steel (high strength requirements) |
| Wearable Devices / IoT | Aluminum Alloy | Lightweight, easy to machine into small/complex shapes | Tin Plate (cost priority) |
| High-Reliability Military | Nickel Silver (C7521) | Excellent reliability, corrosion resistant, good maintainability | Stainless Steel (high-temperature requirements) |
| RF / Magnetic Shielding | Copper or Mu-Metal | Copper has highest conductivity; Mu-Metal has highest permeability | Beryllium Copper (elasticity requirements) |
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