IoT & AI Hardware Shielding Solutions

Our ultra-micro shielding can precision capability:

• Dimensional Precision: ±0.02~±0.03mm, capable of 3×3mm or smaller applications;
• Aperture Precision: 0.3mm apertures precise to ±0.05mm;
• Thickness Precision: 0.3mm thickness controlled to ±0.03mm;
• Consistency: Batch CV value <5%, guaranteeing large-volume use consistency.

We have specialized micro-stamping processes and precision inspection equipment—no dimensional concerns needed.

Multi-Band Coordination Design Method:

• Frequency Band Isolation: Multi-cavity frameworks or multi-layer shielding physically separate different-frequency circuits into different spaces;
• Aperture Optimization: Optimize apertures for each band to avoid resonance and coupling;
• Grounding Design: Multi-layer grounding ensuring complete inter-frequency isolation and grounding;
• Simulation Verification: Use electromagnetic simulation tools (HFSS) predicting multi-band efficiency and optimizing design.

Key is early coordination of all frequency requirements—we coordinate optimal design.

Thermal-Shielding Balance Solutions:

• High-Thermal Materials: Copper or copper-alloy cans with 400+ W/mK thermal conductivity;
• Thermal Pads: Bottom-surface thermal silicone pads (5 W/mK) directly contacting chips;
• Ventilation Shielding: Top or side apertures with cooling fin or airway configurations;
• Thermal Modeling: Thermal simulation (Fluent or Icepak) verifying chip temperatures meet operational requirements.

Typically achieves 50~70% thermal efficiency improvement with 10~20℃ chip temperature reduction.

Wearable device flexibility and reliability requirements:

• Material Selection: High-elasticity alloys (such as phosphor copper) supporting bending deformation;
• Structure Design: Flexible hinges or segmented frames allowing 360° bending;
• Fatigue Testing: 10,000 bend cycle testing ensuring no fracture;
• Contact Design: Elastic contact point design maintaining electrical connection during bending.

We have multiple mature wearable device shielding solutions ready for deployment.

Typical IoT Project Timeline:

• Requirements Confirmation: 1 week confirming can size, bands, frequencies;
• Design & Simulation: 2 weeks conducting electromagnetic and thermal simulation with DFM guidance;
• Prototyping & Verification: 3 weeks including tool design, trial production, efficiency and reliability testing;
• Sample Refinement: 2 weeks microadjusting solution based on test results;
• Mass Production Prep: 2 weeks completing production process verification and first-article reports.

Total approximately 10 weeks (3 months) from concept to production-ready solution. Rush options available down to 8 weeks.