Shenzhen Ruishuo Metal Co., Ltd. — ISO 9001 & IATF 16949 Certified
chinarswj@shieldingcover.com

Multi-CavityEMI Shielding Cover

Internal partition design separates multiple independent RF circuit shielding regions. Ideal for complex PCB layouts, achieving multiple high-isolation circuit sections within a single shielding can. Maximizes space utilization, reduces costs, and simplifies assembly processes.

Product Overview

Multi-Cavity ShieldingPremium Design

Multi-Cavity RF EMI Shielding Can Custom PCB

Independent RF Isolation

Internal partitions completely isolate different frequency RF circuits preventing mutual interference and cross-talk with optimal shielding effectiveness.

Flexible Partition Design

Partition shape, size, and position fully customizable. Support 2-4 cavities, even more independent regions as required.

Space Efficient

Compared to multiple single-cavity cans, multi-cavity solution significantly reduces PCB area consumption, enhancing overall design efficiency.

Simplified Assembly

Single shielding can assembly reduces component quantity, lowers assembly complexity and costs.

Technical Specifications

Multi-Cavity Shielding CoverSpecification Parameters

ItemSpecification
MaterialTin-plated steel, Nickel silver, Stainless steel, Copper, Brass
Cavity Quantity2-4 standard cavities, more cavities customizable
Partition DesignMetal partitions, PCB partitions, hybrid partitions
Partition ContactWelding, snap-fit, spring contact
Shielding EffectivenessEach cavity 80-100dB@1GHz
Operating Temperature-40°C to +120°C
Cavity Isolation>60dB inter-cavity isolation
Application Scenarios

Multi-Cavity ShieldingTypical Applications

5G Base Station Modules

Multiple frequency RF circuit independent shielding isolation.

Premium Smartphones

WiFi + 5G + millimeter-wave multi-module isolation.

Automotive 5G Communication

V2X, millimeter-wave, cellular multi-circuit isolation.

Satellite Communications

Multi-frequency satellite and ground communication isolation.

5G WiFi 6E Router

5GHz and 6GHz multi-band isolation.

Millimeter-Wave Radar

Multiple antenna, multi-frequency circuit independent shielding.

15 Years+
EMI Shielding Manufacturing Experience
1300+
Global Clients
3M Strokes/Day
Daily Production Capacity
100+ Sets/Month
Tooling Development Capability
Trusted By

Chosen by Global Leading Brands

Serving telecom, consumer electronics, automotive, medical and many other industries

ISO 9001 Certified
IATF 16949 Certified
ISO 14001 Certified
NDA Signed
Manufacturing Strength

Professional EMI Shielding Cover Manufacturing Base

20+ high-precision stamping presses, 20-member professional R&D team, 2-3 day fast delivery, providing full-process service from design to mass production

High-Precision Stamping Workshop Stamping Workshop

High-Precision Stamping Equipment

Equipped with 20+ high-speed precision stamping presses, with a daily stamping capacity of 3 million strokes and accuracy of ±0.01mm.

3M Strokes/Day ±0.01mm Precision
EMI Shielding Can Precision Stamping Manufacturing Tooling Center

In-House Tooling R&D Center

20-member professional R&D team, producing 100+ sets of precision tooling per month, from drawings to finished products in as fast as 2-3 days.

20 R&D Engineers 100+ Sets/Month
Quality Testing Laboratory Quality Lab

Full-Process Quality Control

Incoming inspection → In-process control → Final inspection → Shipping inspection, dual certified with ISO 9001 and IATF 16949.

ISO 9001 IATF 16949
Custom Solution

Need Multi-Cavity
Shielding Design?

Our engineers can design optimal multi-cavity solutions based on your PCB layout, RF frequency distribution, and isolation requirements.

Get Quote →Free Sample
Frequently Asked Questions

Multi-Cavity ShieldingCommon Questions

How is inter-cavity isolation guaranteed?
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Metal partitions with complete grounding design achieve >60dB inter-cavity isolation. Partition sides are welded or contact-connected to frame ensuring complete grounding.
How many partition shapes are possible?
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Completely free design. Partitions can be straight, L-shaped, T-shaped, complex curves—fully customized per PCB layout and RF regions.
How do partitions connect to the frame?
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Multiple connection options: Welding (most reliable), snap-fit (removable), spring contact (contact connection). Select based on maintenance needs.
How many cavities maximum supported?
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Theoretically unlimited. Practically, 2-4 cavities are most common. More cavities increase cost and complexity requiring cost-benefit evaluation.
Can inter-cavity through-holes be designed?
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Supported. Partition through-holes enable signal line passage, cooling channels. Holes can incorporate shielding measures ensuring signal integrity.
Cost compared to multiple single-cavity cans?
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Multi-cavity solution typically costs 20-30% less than 3-4 single-cavity cans while reducing assembly complexity—optimal cost-performance solution.